Platable coating and plating process
US7384532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2004 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Feb 1, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of a platable coating composition to the substrate prior to plating. The platable coating composition is cured to render the substrate more receptive to conventional plating techniques. In one embodiment, the process utilizes an epoxy resin system that upon being cured is receptive to electroless plating and electrolytic plating techniques that are the same or similar to those conventionally employed for electroplating ABS and/or PC/ABS substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.