System and method for curing polymeric moldings
US7384590B2 · kind B2 · utility
149Cited by
7References
9Claims
0Family size
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Key dates
| Filing date | Dec 10, 2003 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Jul 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/808
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method for forming a polymeric molding. A mold component includes a UV-absorptive material for preventing undesired reflection or transmission of curing energy within the mold cavity, thereby providing more precise control of the edge geometry of the molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.