Method and apparatus for electrically connecting printed circuit boards or other panels
US7385144B2 · kind B2 · utility
1Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2005 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and then the board and vias are cut to form an edge of the board where a surface of the vias is exposed. The board may be orthogonally mounted on its edge to another thin circuit board or aperture sheet with the exposed surface of each via directly connected to such other board or sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.