Transponder incorporated into an electronic device
US7385284B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2004 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Nov 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An electronic device. The device comprises a metalization layer and an integrated circuit chip incorporated into the device wherein the integrated circuit chip is capacitively coupled to the metalization layer. The device comprises a first substrate having the metalization layer formed on the substrate, a cap layer covering at least the entire metalization layer and at least a portion of the first substrate not covered by the metalization layer. The integrated circuit chip is coupled to the first substrate, and is placed in proximity and in non-physical contact with the metalization layer. A conductive layer is attached to the integrated circuit chip. The conductive layer has at least a portion placed in a non-physical contact with the metalization layer. The integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.