Patent · US Active

Clip assembly

US7385822B1 · kind B1 · utility

5Cited by
9References
15Claims
0Family size

Assignees

Inventors

Key dates

Filing dateJun 11, 2007
Grant dateJun 10, 2008
Priority date
Expiry dateJun 11, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A clip assembly (30) for mounting a heat sink (20) on a printed circuit board (10) includes a closed annular positioning portion (32) interferingly engaging with the heat sink, a securing portion (34) secured to the positioning portion. The securing portion has a pressing member (340) extending through an opening (320) defined in the positioning portion for resiliently abutting against the heat sink, and two arms (344) extending from free ends of the pressing member with a pair of hooks (342) formed at distal portions of the two arms for engaging with the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.