Processor module with rigidly coupled processor and voltage-regulator heat sinks
US7385824B2 · kind B2 · utility
2Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Jan 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.