Patent · US Expired

Solution and method for the treatment of a substrate, and semiconductor component

US7387872B2 · kind B2 · utility

2Cited by

9References

23Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Marcus Halik · Erlangen, DE
Guenter Schmid · Hemhofen, DE
Hagen Klauk · Erlangen, DE
Florian Eder · Erlangen, DE
Ute Zschieschang · Stuttgart, DE

Key dates

Filing date	Dec 22, 2005
Grant date	Jun 17, 2008
Priority date	—
Expiry date	Mar 30, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31993
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

An embodiment of the invention provides a method for the treatment of a substrate made of paper or a substrate containing paper as support material for a semiconductor component. In an embodiment, the substrate surface is contacted with a solution comprising at least one phenol-containing base polymer and/or copolymer and a crosslinker component. A polymer formulation deposits from the solution onto the surface. The solution may further include an acid catalyst. Embodiments include a semiconductor component formed according to the method of the invention.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.