Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
US7388158B2 · kind B2 · utility
2Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the conductor layer. The anti-pad further includes a dielectric spacer formed substantially coplanar with the conductor plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.