Heatsink assembly
US7388746B2 · kind B2 · utility
7Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Jan 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heatsink assembly having a simple structure for coupling a heatsink and an electronic chip is provided with a heatsink which contacts an electronic chip mounted on a substrate and absorbs heat generated from the electronic chip; and a pressing member which is coupled to the substrate and comprises: a pressing cover for pressing the heatsink so that the heatsink can be secured to the electronic chip; and tension parts which extend from the pressing cover and exert a pressing force onto the pressing cover, when being coupled to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.