Methods and apparatuses for thermal dissipation
US7388753B2 · kind B2 · utility
3Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2006 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Jun 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10446
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.