Method and system for angled RF connection using a flexible substrate
US7388756B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Jun 17, 2008 |
| Priority date | — |
| Expiry date | Dec 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.