Anisotropic conductive film and method for producing the same
US7390442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2003 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Sep 26, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.