Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg
US7390571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Feb 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.