Patent · US Expired

Sensor chips with multiple layers of polysiloxane

US7390649B2 · kind B2 · utility

1Cited by

11References

8Claims

0Family size

Assignee

Micronas GmbH · DE

Inventors

Holger Klapproth · Glückstadt, DE
Jürgen Rühe · Mainz, DE
Sonia Mohry · Glückstadt, DE

Key dates

Filing date	Jul 24, 2001
Grant date	Jun 24, 2008
Priority date	—
Expiry date	Jul 24, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31663
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to sensor chips with multiple layers of polysiloxane with improve homogeneity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.