Integrated circuit including a temperature monitor element and thermal conducting layer
US7391092B2 · kind B2 · utility
2Cited by
1References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.