Image sensor module
US7391458B2 · kind B2 · utility
70Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Sep 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor module (X1) includes a housing (1), a lens retainer (2), an image sensor chip (4), a substrate (5) and a lens unit (A, B). The housing (1) is formed with a step portion (1a) for fixing the lens unit (A, B). The lens retainer (2) is fixed to the housing (1) and held in contact with the upper face of the lens unit (A, B). The lens unit (A, B) is pressed against the step portion (1a) of the housing (1) by a biasing force of the lens retainer (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.