Hybrid optical/electronic structures fabricated by a common molding process
US7391572B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2006 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Oct 21, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B19/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method of fabricating a molded structure including both micro lenses and metallic pins. The method comprises the steps of providing a mold apparatus having a set of first cavities and a set of second cavities, depositing a first material in the first cavities to form a set of metallic pins, and depositing a second material in the second cavities to form a set of micro lenses. The formed molded structure comprises a substrate, a set of molded microlenses on said substrate, and a set of molded metallic pins on that same substrate. The metallic pins may be formed as alignment pins or as electrical connectors. The invention enables the micro lenses and metallic pins to be manufactured by way of molding on a common substrate for the first time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.