Method and system for an interchangeable headset module resistant to moisture infiltration
US7391863B2 · kind B2 · utility
63Cited by
25References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2004 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Aug 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/6058
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A headset assembly includes a moisture-proof and temperature resistant headset module. The headset module is sealed against moisture and is constructed from materials that are durable and can withstand constant use, physical abuse, and rapid swings in temperature and other environmental conditions. Furthermore, the headset module is interchangeable with a variety of headset frames so as to provide comfort during prolonged use and in high ambient noise environments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.