Reducing relative intermodule motion in a modular implantable medical device
US7392089B2 · kind B2 · utility
55Cited by
105References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2003 |
| Grant date | Jun 24, 2008 |
| Priority date | — |
| Expiry date | Oct 18, 2025 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3758
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A modular implantable medical device includes a plurality of modules that are at least partially encapsulated by an overmold. The modules may be connected by coupling modules, which may be flexible to provide for one or more degrees of relative intermodular motion. The overmold may also be flexible. In order to reduce relative intermodule motion to acceptable direction and/or ranges, the overmold may include one or more motion reduction elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.