Dummy substrate processing method with chemical resistant resin layer coating plate surface
US7392599B2 · kind B2 · utility
3Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Apr 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31641
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dummy substrate is obtained by covering a silicon substrate with a resin coating. This increases the strength of the dummy substrate, prevents pieces and particles of the silicon substrate from scattering, and even when the dummy substrate is damaged during processing, prevents them from contaminating a processing apparatus. The use of a chemical-resistant resin for the resin coating restrains the dummy substrate from being etched by a cleaning process using a chemical solution and increases the number of times that the dummy substrate can repeatedly be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.