Sealing of organic thin-film light-emitting devices
US7393257B2 · kind B2 · utility
15Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Jan 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8723
Abstract
A method for hermetically sealing an organic thin-film light-emitting device between a substrate and a cover including the steps of bringing the substrate and cover into close proximity at a peripheral side edge of at least one of the substrate or cover, bringing an energy absorbing material into contact with the cover and substrate at the peripheral side edge of at least one of the substrate or cover, and applying energy directly to the energy absorbing material, causing the energy absorbing material to transfer heat to the substrate and the cover to fuse and form a hermetic seal along the peripheral side edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.