Method of binding a compound to a sensor surface
US7393448B2 · kind B2 · utility
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22Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 23, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method of non-covalently binding a compound to a sensor surface. The method comprises adsorbing a hydrophobin-like substance to at least a part of the sensor surface, such as an electrode. The invention further provides a sensor having a surface, at least a part of which is provided with a coating of a hydrophobin-like substance that comprises a non-covalently bonded compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.