Microetching solution
US7393461B2 · kind B2 · utility
1Cited by
11References
17Claims
0Family size
Inventors
Key dates
| Filing date | Aug 23, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Mar 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.