Dicopper(I) oxalate complexes as precursor for metallic copper deposition
US7393555B2 · kind B2 · utility
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5References
23Claims
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Key dates
| Filing date | Mar 29, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Oct 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12493
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The invention relates to dicopper(I) oxalate complexes stabilized by neutral Lewis bases, such as alkenes or alkynes, and to the use of dicopper(I) oxalate complexes as precursors for the deposition of metallic copper, in which the neutral Lewis bases used are alkynes, alkenes, triarylphosphines, CO or isonitriles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.