Fluidic MEMS device
US7393712B2 · kind B2 · utility
17Cited by
16References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0061
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.