Method for mounting an electronic part on a substrate using a liquid containing metal particles
US7393771B2 · kind B2 · utility
13Cited by
4References
13Claims
0Family size
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Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Jun 22, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.