Method and apparatus for producing co-planar bonding pads on a substrate
US7393773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Feb 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/1184
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.