Preparation of integrated circuit device samples for observation and analysis
US7394075B1 · kind B1 · utility
3Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Sep 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31745
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a sample of an integrated circuit device is prepared for observation in a transmission electron microscope (TEM). The sample may be placed on a surface formed by vertical edges of several TEM grids. The sample may be affixed to a vertical edge of one of the TEM grids. The TEM grid supporting the sample may be separated from the other TEM grids, and then placed in the TEM so that the sample may be observed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.