Method and apparatus for providing thermal management in an electronic device
US7394654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.