Temperature sensing device
US7395173B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.