Patent · US Active

Mechanical property measurement of thin films by micro plane-strain compression

US7395722B2 · kind B2 · utility

2Cited by

13References

12Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventor

Li Lin · Saratoga, US

Key dates

Filing date	Nov 21, 2006
Grant date	Jul 8, 2008
Priority date	—
Expiry date	Jan 5, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01L25/00
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

This invention is directed to the measurement of stress-strain relationships in thin films using substantially flat, parallel test surfaces with minimal width. This invention is further directed to the measurement of stress-strain relationships in thin films at controlled temperatures and at high strain rates above 100% per second.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.