Multiple internal seal ring micro-electro-mechanical system vacuum packaging method
US7396478B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 5, 2007 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Sep 5, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.