Electrically conductive resin compounds based on polyoxymethylene and highly structured carbon black
US7396492B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Mar 30, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention in one aspect is a polyoxymethylene compound exhibiting an improved balance of properties and volume resistivity of 100-106 ohm-cm, which comprises polyoxymethylene, polyethylene glycol, metal oxide, high-structure carbon black and a comb polymer. The invention is more particularly directed to a polyoxymethylene compounds and molded articles therefrom in which the compound comprises 30 to 98.7% by weight of a polyoxymethylene homopolymer or copolymer, from 0.1 to 10% by weight of a polyalkylene glycol, from 0.1 to 10% by weight of metal oxide, from 1% to 15% of a high structured particulate carbon black, and from 0.1 to 15% by weight of a comb polymer containing a relatively less polar backbone with relatively more polar side chains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.