Radiation curable thermal transfer elements
US7396631B2 · kind B2 · utility
12Cited by
71References
2Claims
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Key dates
| Filing date | Oct 7, 2005 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Oct 7, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.