Thermal mass transfer substrate films, donor elements, and methods of making and using same
US7396632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2007 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Substrate films, thermal mass transfer donor elements, and methods of making and using the same are provided. In some embodiments, such substrate films and donor elements include at least two dyads, wherein each dyad includes an absorbing first layer and an essentially non-absorbing second layer. Also provided are methods of making a donor element that includes an essentially non-absorbing substrate, an absorbing first layer, and a non-absorbing second layer, wherein the composition of the essentially non-absorbing substrate is essentially the same as the composition of the essentially non-absorbing second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.