Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus
US7396704B2 · kind B2 · utility
2Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2006 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Jan 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This method of manufacturing a lid made of a transparent resin comprises a step of introducing a resin into a cavity for molding a protrusion continuous with a cavity for molding a lid in a die; a step of forming a molded body including a lid and a protrusion continuous with the lid by solidifying the resin in the cavity for molding a lid and the cavity for molding a protrusion, respectively; a step of separating the molded body from the die by ejecting an ejector pin to the protrusion; and a step of separating the protrusion from the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.