Microdisplay packaging system
US7397067B2 · kind B2 · utility
0Cited by
23References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Mar 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/60
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.