Cooler module and its fastening structure
US7397667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2007 |
| Grant date | Jul 8, 2008 |
| Priority date | — |
| Expiry date | Mar 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooler module mounted on a CPU on a circuit board inside a computer is disclosed to include a mounting base frame, which is made of a thermal conductive material and has a heat-transfer zone disposed in contact with the CPU and two arms respectively extended from two sides of the heat-transfer zone and affixed to the circuit board and two eyelet lugs vertically extended from two sides of the distal end of one of the two arms, a heat pipe, which has one end supported on the heat-transfer zone of the mounting base frame, an elongated retaining member, which has two lugs disposed at one end thereof and respectively fastened to the eyelet lugs of the mounting base frame, and a buffer member fastened to the heat-transfer zone to hold down heat pipe on the heat-transfer zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.