SOI component comprising margins for separation

US7398588B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Oliver Stoll · Kirchheim unter Teck, DE
• Franz Laermer · Stuttgart, DE
• Gilbert Moersch · Stuttgart, DE
• Gottfried Flik · Leonberg, DE
• Klaus Kuettner · Chicago, US

Key dates

• Filing date: May 6, 2003
• Grant date: Jul 15, 2008
• Expiry date: Mar 12, 2024

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49156
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or compression, as well as electrical structures which are in connection therewith. To this end, a sacrificial layer is produced on or within a substrate and an activatable layer on top of the sacrificial layer, the sensitive region and at least a portion of the electrical structures being positioned on top or within an activatable layer, and a circumferential trench is produced around the region of the sensor element to be produced and having the sensitive region and the portion of the electrical structures, the trench being interrupted by at least one connecting point, which connects the region of the sensor element to the portion of the activatable layer lying outside the circumferential trench. This is followed by a removal of the sacrificial layer underneath the region of the sensor element, a fixation of the region of the sensor element with the aid of a holding device, rupturing of the connecting points and a transfer of the sensor element, fixated by the holding device, and connecting a car…