Patent · US Expired

Micromechanical sensor element

US7398671B2 · kind B2 · utility

4Cited by

9References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Ralf Brederlow · Poing, DE
Roland Thewes · Puchheim, DE

Key dates

Filing date	Mar 15, 2002
Grant date	Jul 15, 2008
Priority date	—
Expiry date	Mar 15, 2022

Classification

Technology area (CPC G)Physics
CPC primaryG01N2291/02863
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical sensor element for recording the bonding of molecules to the micromechanical sensor element. The sensor element having a substrate and at least one electrical terminal. There is also an oscillatable element that is coupled to the electrical terminal in such a manner that an electrical variable that characterizes the oscillation behavior of the oscillatable element may be provided at the electrical terminal. Further, there is a molecule coupling layer, arranged in such a manner that molecules may bond to the molecule coupling layer. The molecule coupling layer is coupled to the oscillatable element in such a manner that bonding of molecules to the molecule coupling layer causes a change in the oscillation behavior of the oscillation element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.