Apparatus and method for processing wafers
US7398801B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2005 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for manufacturing semiconductor devices are disclosed. In accordance with the invention, a wafer transfer device for transferring wafers from wafer storage containers to wafer processing equipment includes a flow chamber designed to reduce the amount of contaminants that can enter the wafer container. The wafer transfer apparatus provide two gas inlets for allowing two gases to flow through the flow chamber of the transfer apparatus. This results in a reduced amount of contaminants able to enter the wafer container, which in turn results in manufacture of devices with more reliable performance characteristics as well as high manufacturing yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.