Process of attaching reinforcing ply to ply containing mica-rich and mica-poor faces
US7399379B2 · kind B2 · utility
7Cited by
31References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2005 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Mar 4, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a sheet structure for electrical insulation or flame resistance comprising a barrier ply having a mica-rich face and a mica-poor face and a reinforcing ply containing a saturable backing layer attached to the mica-poor face of the barrier ply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.