Non-rigid conductor link measurement sensor and method for the production thereof
US7400514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2004 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed circuit board carrying the electronic processing circuits associated with the microsensor cell. In order to establish a non-rigid electrical connection between a conductive terminal of the board and a connection pin of the cell, a narrow strip-shaped conductive connection cut by chemical machining from a thin and flexible metal sheet (CuBe) is soldered. The strip comprises at least one circle-arc segment extending over one half-turn or three-fourths of a turn. Its resilience permits very low stiffness in all directions and therefore prevents any transmission of vibrations or shocks to the cell. The manufacture of the connections may be collective for all the connections of a sensor and for successive sensors manufactured serially. Application to accelerometers subjected to large shock and vibration stresses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.