Determination of the gas pressure in an evacuated thermal insulating board (vacuum panel) by using a heat sink and test layer that are intergrated therein
US7400999B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2003 |
| Grant date | Jul 15, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to the determination of the gas pressure in an evacuated thermal insulating board (9) having an insulating core (1) covered by a film (2). The inventive device comprises an assembly, which is integrated between the insulating core and the covering film of the thermal insulating board and which has a body that acts as a heat sink (3) (Al, Co, Fe, ceramic), and the body's thermal conductivity and thermal capacity relative to volume are greater than those of the insulating core. Said assembly also comprises a test layer (4) (0.3 mm nonwoven fabric made of plastic and glass fibers), which is arranged between the heat sink and the covering film and has a defined thermal conductivity that changes according to the gas pressure inside the evacuated thermal insulating board. From the exterior, a sensor device is applied to or pressed against the test device, which is placed inside the evacuated thermal insulating board and which is covered by the covering film. Said sensor device comprises a body (5) (coppered steel 78° C., thermoelement (6)) having a distinctly different temperature than that of the test device (heat sink) whereby creating a heat flux, which is influe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.