Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
US7401403B2 · kind B2 · utility
1Cited by
5References
30Claims
0Family size
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Key dates
| Filing date | Dec 20, 2004 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Feb 15, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
Abstract
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.