Modular heating or cooling system
US7401472B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 2, 2004 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Jul 4, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2339/043
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A refrigeration system module including a frame, a heating plate having a fluid inlet and a fluid outlet and a first heat transfer surface, a cooling plate having a fluid inlet and a fluid outlet and a second heat transfer surface, an expansion device disposed between the heating and cooling plates and in fluid communication with the heating plate fluid outlet and the cooling plate fluid inlet, and a hermetic compressor assembly. The compressor assembly is disposed between the heating and cooling plates and has a discharge outlet in fluid communication with the heating plate inlet, and a suction inlet in fluid communication with the cooling plate fluid outlet. The heating plate, the cooling plate, the expansion device and the compressor are fixed to the frame, and the first and second heat transfer surfaces each at least partially define an exterior surface of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.