Coaxial gapless guide-through assembly for a filing level sensor
US7401511B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2004 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Mar 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a guide-through assembly (4) for a filling level sensor working according to the principle of delay measurement of guided electromagnetic waves or for a capacitive filling level sensor, which for sealing the interior of the vessel against the interior of the sensor has no elastomeric sealing materials and in particular no elastomeric o-rings seals. This can be ensured by precisely machining the components which are essentially concentrically arranged in the guide-through assembly (4) on their circumferential surfaces (10, 11), so that in an assembled state the components arranged in the guide-through assembly (4), such as the interior conductor (7) and the dielectric materials (9, 12, 14) surrounding the interior conductor (7), contact each other at their mutually adjacent circumferential surfaces (11) in a sealing and positive engagement, so that additional sealing elements are not needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.