Telecommunications jack with crosstalk compensation provided on a multi-layer circuit board
US7402085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2006 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Apr 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes first and second conductive layers separated by a relatively thin dielectric layer. The first and second conductive layers include a crosstalk compensation arrangement having spaced-apart capacitor members. The relatively thin dielectric layer allows a high level of capacitance to be generated between the capacitor members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.