Method for production of contactless chip cards and for production of electrical units comprising chips with contact elements
US7402460B1 · kind B1 · utility
2Cited by
8References
50Claims
0Family size
Inventor
Key dates
| Filing date | Oct 6, 2000 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method of producing electrical units consisting of chips with contact elements, wherein the contact elements are suited for the direct connection with contact terminals of external electric components in an electrically conductive manner, wherein the connection of the contact elements with the chips is effected before the individual chips are removed from the grouping predefined by the wafer and consisting of rows and columns, and the contact elements are made of a metallized plastic foil or metallic foil to be applied onto the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.