Method of manufacturing a semiconductor device by using a matrix frame
US7402502B2 · kind B2 · utility
1Cited by
5References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | Jul 22, 2008 |
| Priority date | — |
| Expiry date | Mar 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the semiconductor chip in blocks. After the semiconductor chip is sealed by the sealing resin, inner leads which are extended from the sealing resin are punched by a punching blade. Then, the block is diced to individual semiconductor devices by a rotary blade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.